Apple explores Intel chip manufacturing alliance
Apple has reached a preliminary agreement with Intel to manufacture some chips for its devices, reflecting mounting pressure on semiconductor supply chains as Artificial Intelligence demand absorbs advanced capacity. The move also aligns with Washington’s push to expand domestic chip production and revive Intel’s foundry business.
Why businesses must act now on agentic Artificial Intelligence risk
Businesses are moving from generative tools to autonomous Artificial Intelligence agents that can execute tasks with limited human input. That shift is creating urgent governance, security, and accountability risks, underscored by recent concerns around OpenClaw.
US signals proactive approach on Artificial Intelligence regulation
US federal and state agencies are showing signs of a more proactive stance on Artificial Intelligence oversight, especially around security. The shift contrasts with more sector-specific or horizontal regulatory models emerging in the UK, Europe, Singapore and Japan.
Apple and Intel foundry services reach preliminary U.S. chip deal
Apple has reportedly reached a preliminary agreement with Intel Foundry Services to manufacture Apple Silicon in the U.S. The arrangement could reduce Apple’s dependence on TSMC while aligning with U.S. efforts to onshore chip production.
Google expands its Artificial Intelligence push across chips, cloud, and agents
Google’s recent Artificial Intelligence activity spans infrastructure, enterprise software, open models, and major partnerships. The company is pairing aggressive capital spending with deeper integration of Gemini across products and external platforms.
Intel confirms ongoing product collaboration with NVIDIA
Intel CEO Lip-Bu Tan says work with NVIDIA is continuing, with new products expected from a partnership announced late last year. The collaboration points to deeper integration across client and server chips, including GeForce RTX graphics in Intel SoCs and customized Xeon processors for NVIDIA systems.
SK hynix explores Intel EMIB for HBM packaging
SK hynix is working with Intel on 2.5D packaging research for HBM memory as it looks to diversify its supply chain. The move could help align future HBM4 modules with Intel Foundry packaging options for next-generation Artificial Intelligence chips.