eeNews Embedded page 4 roundup of product launches and technology briefs
On page 4 eeNews Embedded curates product announcements and technology briefs, from on-device Artificial Intelligence model optimisation to wireless SoCs and post-quantum MCUs.
OKI develops tiling CFB to integrate optical semiconductors on 300 mm silicon
As demand driven by Artificial Intelligence expands data centers, OKI´s tiling crystal film bonding enables small optical wafers to be placed on 300 mm silicon, advancing photonics-electronics convergence.
Artificial intelligence in social media UK: transforming engagement, marketing and content creation
How Artificial Intelligence is reshaping UK social media with hyper-personalised marketing, content at scale, smarter analytics and faster customer support.
Intel showcases Arm-based reference SoC built on 18A node
Intel presented a ´Deer Creek Falls´ Arm-based reference SoC on its 18A node, illustrating heterogeneous core mixes and third-party IP integration for foundry customers.
Apple M5 silicon adopts LMC packaging, paving the way for CoWoS
Eternal Materials will supply liquid molding compound for Apple M5 and molding underfill for the A20 iPhone, shifting a key packaging role to a taiwanese supplier and aligning Apple and TSMC on higher bandwidth, denser chip layouts.
Trump administration weighing stake in Intel, Bloomberg reports
Bloomberg reports the US is considering using CHIPS Act funds to buy a stake in Intel as the company battles delays and struggles in the Artificial Intelligence chips market.
Intel posts update on Project Battlematrix, releases LLM Scaler 1.0
Intel´s Project Battlematrix brings containerized workstations and LLM Scaler 1.0 to speed up enterprise Artificial Intelligence inference with multi-gpu scaling and reliability features.
Intel and U.S. government open talks on restoring advanced chip manufacturing
President Donald Trump met with Intel CEO Lip-Bu Tan to discuss restoring leading-edge semiconductor manufacturing and U.S. technology leadership.
TSMC phases out 6-inch wafer production and consolidates legacy fabs
TSMC will retire 6-inch wafer lines and reorganize Hsinchu fabs, urging customers to shift short term to 200 millimeter capacity and plan longer term moves to 300 millimeter gigafabs where Artificial Intelligence and high-performance economics are stronger.
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