Page 4 of eeNews Embedded presents a dense roundup of recent announcements in embedded electronics, ranging from new products to technology and business briefs. The listing covers items published in mid to late May 2025 and spans categories such as technology news, business news, and new products. Readers will find concise descriptions, publication dates, and links for deeper reading, with pagination indicating this is part of a long-running archive of embedded industry coverage.
Several stories highlight efforts to push computation and security to the edge. A featured item describes an on-device Artificial Intelligence model breakthrough: the ´Nota´ model optimisation platform leverages the ´Qualcomm AI hub´ to streamline development for edge and generative Artificial Intelligence, enabling deployment on resource-constrained devices. Complementing that, a wireless SoC announcement stresses a 22nm process node that delivers improvements in computing performance, power efficiency, integration, and security, aimed at Internet of Things applications. At infrastructure scale, Infineon and NVIDIA are reported to partner on a high-voltage power delivery architecture for data centres, signalling hardware-level moves to support growing Artificial Intelligence workloads. Security and cryptography also appear: a report flags the rapid pace of generative Artificial Intelligence as a top security risk, while Microchip´s MEC175xB microcontrollers aim to bring post-quantum cryptography into embedded systems.
Beyond those headlines the page aggregates a broad set of product and research items: virtual reality used to accelerate robot operator training, Mobileye imaging radar selected for SAE level 3 applications, quantum imaging techniques to aid magnetics design, and collaborations on AR smart glasses. There are also launches of UV LED sources, ultra-compact GNSS receivers, industrial sensors with embedded intelligence, neuromorphic chips, and co-processors tuned for neural processing. Together these entries form a snapshot of where embedded design and system-level innovation are heading: more compute on the edge, tighter hardware-software integration, and growing attention to security and cryptography as Artificial Intelligence use expands. The compilation is a practical feed for engineers and product teams tracking component-level advances and emerging system architectures.
