AI News

Impact Score

CXMT ramps up HBM3 mass production to support Chinese artificial intelligence chips

11 Feb 2026

ChangXin Memory Technologies is moving into mass production of HBM3 modules, signaling a major expansion of China’s domestic high-bandwidth memory supply for artificial intelligence accelerators and mainstream computing partners.

artificial intelligence, china, memory, semiconductors

Impact Score

Applied Materials debuts new transistor systems for 2 nm logic chips

11 Feb 2026

Applied Materials is rolling out new deposition, etch and materials modification systems designed to enhance performance and energy efficiency for 2 nm-class Gate-All-Around logic chips used in Artificial Intelligence computing.

artificial intelligence, hardware, manufacturing, semiconductors

Impact Score

AMD Medusa Halo APU set to pair Zen 6 and RDNA 5 with LPDDR6 memory

11 Feb 2026

AMD’s upcoming Medusa Halo Ryzen Artificial Intelligence MAX APU is rumored to combine up to 24 Zen 6 cores and 48 RDNA 5 compute units with a wide LPDDR6 interface. Early LPDDR6 modules from Samsung and Innosilicon highlight the bandwidth and efficiency gains this platform could tap.

cpus, gpus, memory, semiconductors

Impact Score

ByteDance’s Seedance 2.0 video model sparks copyright and misinformation concerns

11 Feb 2026

ByteDance’s Seedance 2.0 is drawing intense interest for its lifelike, audio-synced video generation while provoking fresh scrutiny over copyright, training data and misinformation risks.

artificial intelligence, china, copyright, video generation

Impact Score

Cisco unveils new infrastructure for secure agentic artificial intelligence

11 Feb 2026

Cisco introduced new silicon, systems, and security capabilities designed to support large scale, secure deployments of agentic artificial intelligence across data centers and sovereign environments.

artificial intelligence, cisco, networking, security

Impact Score

Cisco launches Silicon One G300 to scale gigawatt artificial intelligence data centres

11 Feb 2026

Cisco has introduced the Silicon One G300 chip to power gigawatt-scale artificial intelligence data centres, promising 28% faster job completion for agentic workloads and tighter integration of networking, cooling and management. The platform targets hyperscalers and enterprises looking to maximise GPU utilisation as artificial intelligence clusters expand.

artificial intelligence, cisco, data centres, networking hardware

Impact Score

Databricks CEO says software as a service will be transformed by artificial intelligence interfaces

11 Feb 2026

Databricks is using large language model interfaces to drive rapid revenue growth while arguing that software as a service will persist but become largely invisible as natural language replaces traditional user interfaces.

artificial intelligence, cloud-computing, enterprise software

Impact Score

Toolformer lets language models teach themselves to use external tools

11 Feb 2026

Meta researchers introduce Toolformer, a language model training method that enables self-supervised learning of when and how to call external tools via simple APIs, such as calculators and search engines, without sacrificing core language abilities.

large language models, meta, natural language processing

Impact Score

How to build low latency voice agents with the OpenAI API

11 Feb 2026

OpenAI outlines two main architectures for building voice agents and explains how to design prompts, handle audio, and integrate specialized models for real world use cases.

agents, audio and voice, openai

Impact Score

Intel shuts down software defined silicon paywall for server features

11 Feb 2026

Intel has quietly ended its software defined silicon On Demand program for Xeon servers after customers rejected the idea of paying extra to unlock built-in hardware features. The move signals a pullback from hardware paywalls that had raised concerns about feature gating beyond traditional software subscriptions.

chips, cloud-computing, enterprise IT, intel

Impact Score

Imec opens NanoIC pilot line cleanroom to drive sub-2nm chip R&D

11 Feb 2026

Imec has opened a major cleanroom expansion in Leuven to anchor Europe’s NanoIC pilot line for next generation sub-2nm systems-on-chip and advanced manufacturing research.

european policy, research and development, semiconductors

Impact Score

Qualcomm tipped to adopt Samsung heat path block tech in next-gen Snapdragon

11 Feb 2026

Leaked packaging schematics suggest Qualcomm's next Snapdragon flagship could integrate Samsung's heat path block cooling design, signaling closer ties between the rival chipmakers. The move targets thermal bottlenecks that have constrained recent high-end mobile processors.

hardware design, mobile chips, semiconductors