AMD Medusa Halo APU set to pair Zen 6 and RDNA 5 with LPDDR6 memory

AMD’s upcoming Medusa Halo Ryzen Artificial Intelligence MAX APU is rumored to combine up to 24 Zen 6 cores and 48 RDNA 5 compute units with a wide LPDDR6 interface. Early LPDDR6 modules from Samsung and Innosilicon highlight the bandwidth and efficiency gains this platform could tap.

Cisco launches Silicon One G300 to scale gigawatt artificial intelligence data centres

Cisco has introduced the Silicon One G300 chip to power gigawatt-scale artificial intelligence data centres, promising 28% faster job completion for agentic workloads and tighter integration of networking, cooling and management. The platform targets hyperscalers and enterprises looking to maximise GPU utilisation as artificial intelligence clusters expand.