Synopsys has revealed an expanded partnership with Samsung Foundry aimed at accelerating the development of next-generation artificial intelligence, high-performance computing (HPC), and multi-die solutions. The collaboration leverages Synopsys´ 3DIC Compiler software alongside Samsung’s latest packaging technologies to help customers achieve rapid and successful tape-outs of increasingly complex designs. Through this synergy, mutual clients can access enhanced electronic design automation (EDA) flows tailored for Samsung’s SF2P manufacturing process, resulting in improved power, performance, and area (PPA) metrics for their semiconductor products.
The companies are particularly focused on reducing integration risks by providing customers with a certified lineup of intellectual property (IP) optimized for Samsung’s most advanced process technologies, including sub-2 nanometer nodes. By combining Synopsys´ design tools and expertise with Samsung´s leading-edge foundry capabilities, companies are empowered to bring innovative silicon solutions to market more quickly while managing both complexity and efficiency.
John Koeter, senior vice president of the Synopsys IP Group, highlighted how the rising adoption of edge artificial intelligence solutions is driving the demand for advanced semiconductor innovation. He emphasized that this collaboration is enabling high-end artificial intelligence processors across diverse use cases—from power-hungry inference engines in data centers to ultra-low-power edge devices like cameras and drones. All these deployments benefit from customized development flows and IP integration on Samsung’s latest process nodes, helping industries expand artificial intelligence functionalities at scale. The partnership underscores the growing industry momentum toward tightly integrated software and hardware ecosystems as foundational for breakthroughs in artificial intelligence and multi-die chip architectures.
