Solidrun has introduced what it describes as the first industrial PC based on the AMD Ryzen Artificial Intelligence 9 HX 370, positioning the system as a compact and ruggedized x86 platform for secure and robust edge Artificial Intelligence processing. The bedrock rai300 fanless edge PC combines high performance Zen 5 cores, a Radeon integrated GPU, an XDNA neural processing unit and high memory capacity to address demanding inference and analytics workloads outside the data center.
According to the company, the AMD Ryzen Artificial Intelligence 9 HX 370 processor contains a 12C/24T Zen 5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU, giving the system a mix of general compute, graphics acceleration and dedicated neural processing in a single package. Support for the latest AMD ROCm 7 stack is highlighted as a way to tap into modern software tooling for deploying and optimizing Artificial Intelligence models on the Radeon GPU and XDNA NPU.
The design emphasizes local processing of Artificial Intelligence workloads rather than relying on cloud resources, with the company stating that up to 128 GB of DDR5 capacity allows for the local execution of large Artificial Intelligence models. By pairing this memory footprint with the Zen 5 CPU cores, Radeon 890M graphics and 50 TOPS NPU in a fanless, industrial grade chassis, Solidrun is targeting use cases that require reliable, on site Artificial Intelligence inference and data processing in a compact edge form factor.
