SK Hynix has updated its road map for 2026, delaying a planned acceleration of next-generation HBM4 capacity. The company had intended to expand HBM4 output in the second quarter of 2026, but now expects that increase to occur in the third quarter of 2026. The shift reflects a tactical move to scale HBM4 manufacturing capacity while responding to current market conditions.
The delay is driven by unexpectedly high demand for SK Hynix’s HBM3E products, which has led the company to keep HBM3E manufacturing sites operating longer than originally planned. Rather than converting existing capacity immediately to HBM4, SK Hynix will expand HBM4-specific capacity before ramping production, a decision the company frames as necessary to meet near-term demand without disrupting supply of its in-market HBM3E chips.
Customer dynamics are a key factor in the timing change. SK Hynix’s largest HBM customer, NVIDIA, is reportedly encountering challenges with volume production of ‘Rubin’, which reduces immediate demand for HBM4 devices. At the same time, NVIDIA’s HBM3E-equipped ‘Blackwell’ platform remains in strong demand, sustaining the need for continued HBM3E output. The company appears to be mirroring a similar approach by a competitor that also slowed HBM4 conversion to prioritize current-generation demand, positioning SK Hynix to expand future HBM4 capacity without undermining present market requirements.
