Intel has begun emib assembly at Amkor’s facility in Incheon, South Korea as part of a move to scale packaging output quickly in response to unexpected market demand. The company is working with long-time osat partner Amkor to accelerate production volumes and avoid the delays that internal expansion would bring. According to the report, some emib capacity will be held for Intel’s own upcoming products while the rest helps meet orders from large Artificial Intelligence customers.
The arrangement underscores the current capacity crunch for advanced heterogeneous packaging, with hyperscalers and Artificial Intelligence chip companies placing large orders for cowos and similar services. While TSMC has been a primary choice for many high-density assemblies, growing interest in Intel’s emib and foveros options is prompting partners such as MediaTek, Google, Qualcomm, and Tesla to consider alternatives. Outsourcing to Amkor reduces lead times compared with shifting production solely within the United States and positions emib as a potential external revenue source ahead of Intel’s next process node launches.
This collaboration builds on the Intel-Amkor partnership announced in late May of this year and represents a tactical step to capture near-term demand for advanced packaging. By leveraging Amkor’s capacity, Intel can respond quickly to surges from major customers while retaining the flexibility to allocate capacity to its own roadmap. The move illustrates how packaging partnerships are being used to bridge immediate supply gaps as the industry adapts to increasing demand for complex assemblies.
