CEA-Leti demonstrates die-to-wafer hybrid bonding at 1 μm pitch
CEA-Leti presented a functional die-to-wafer hybrid bonding test vehicle with pitches down to 1 μm at ECTC 2026. The work targets higher interconnect density and bandwidth for high-performance computing, smart-vision systems, and Artificial Intelligence accelerators.
China approves first invasive brain-computer interface for clinical use
China has cleared NEO, an invasive brain-computer interface from Neuracle Technology and Tsinghua University, for use beyond clinical trials in some paralysis patients. The approval marks a major shift from laboratory research toward broader clinical deployment and manufacturing.
NVIDIA expands local Artificial Intelligence agents across RTX PCs and DGX Spark
NVIDIA introduced RTX Spark and a broader set of software, model, and partner updates aimed at bringing secure local Artificial Intelligence agents to Windows and Linux systems. The push spans consumer RTX PCs, enterprise desktops, creative apps, and open source tooling.
China advances invasive brain-computer implants
China has approved the world’s first invasive brain-computer chip for use beyond clinical trials, marking a major step in its effort to lead the field. The milestone highlights both a patient breakthrough and a broader national push around brain-computer interfaces.