Tech firms commit billions to Artificial Intelligence infrastructure

Amazon, OpenAI, Nvidia, Meta, Google and others are signing increasingly large cloud, chip and data center agreements as demand for Artificial Intelligence infrastructure accelerates. The latest wave of deals spans investments, compute purchases, chip supply agreements and data center buildouts.

JEDEC outlines LPDDR6 expansion for data centers

JEDEC has previewed planned updates to LPDDR6 aimed at pushing the memory standard beyond mobile devices and into selected data center and accelerated computing use cases. The roadmap includes higher-capacity packaging options, flexible metadata support, 512 GB densities, and a new SOCAMM2 module standard.

Tsmc debuts A13 process technology

Tsmc has introduced its A13 process at its 2026 North America Technology Symposium as a tighter version of A14 aimed at next-generation Artificial Intelligence, high performance computing, and mobile designs. The company positions the node as a more compact and efficient option with backward-compatible design rules for faster migration.

Google unveils eighth-generation tensor processor units

Google introduced its eighth generation of custom tensor processor units with separate designs for training and inference. The new TPU 8t and TPU 8i are aimed at large-scale model training, serving, and agentic workloads.