DEEPX launches DX-H1 V-NPU, 30 W single-chip Artificial Intelligence video solution

DEEPX announced the DX-H1 vision neural processing unit, a single-chip Artificial Intelligence video intelligence solution that processes hundreds of video channels using 30 W ahead of CES 2026.
EU probes Google over use of online content to power Artificial Intelligence; Ford among corporate headlines

The European Commission is investigating whether Google imposed unfair terms on publishers over use of online content to train Artificial Intelligence. A Dow Jones round-up also covers Ford and Renault’s European collaboration, major corporate moves and chip export decisions.
TSMC’s advanced packaging reportedly at max capacity as Artificial Intelligence demand grows

UDN Money reports TSMC’s ‘entire CoWoS series of advanced packaging products’ is fully booked amid rising demand from Artificial Intelligence hardware players, prompting talks of third-party outsourcing and a possible conversion of the planned P6 fab in Arizona.
FCA launches Artificial Intelligence live testing and updates on complaints, crypto and ESG

The FCA has launched an Artificial Intelligence live testing programme to help firms deploy models safely and set out a package of regulatory changes covering complaints reporting, motor finance, cryptoassets and ESG ratings.
Indian Artificial Intelligence royalty proposal targets data practices of OpenAI, Google

An Indian government panel has proposed requiring Artificial Intelligence companies to pay content creators a share of revenue when their work is used to train models, a proposal that targets the data practices of OpenAI and Google.
How Artificial Intelligence-generated prose diverges from human writing and why it matters

Researchers and journalists are tracking subtle shifts in English linked to Artificial Intelligence output, from the rise of words like ‘delve’ to stylistic tendencies that could reshape newsroom practice.
US to allow Nvidia H200 chip shipments to China, Trump says

President Donald Trump said the United States will allow shipments of Nvidia H200 chips to China, while voicing concerns about Artificial Intelligence chips aiding China’s military and noting the same approach would apply to AMD and Intel.
Imec 3D HBM-on-GPU STCO study shows major thermal improvements for Artificial Intelligence workloads

At the 2025 IEEE International Electron Devices Meeting, Imec presented the first thermal system-technology co-optimization study for 3D HBM-on-GPU and reported peak GPU temperatures falling from 140.7°C to 70.8°C under realistic Artificial Intelligence training workloads.