The road to artificial general intelligence

Founders and researchers debate whether current advances will yield Artificial Intelligence that matches human flexibility, and which hardware, software, and orchestration steps would make that possible.

Intel wins Tesla Dojo 3 packaging contract in dual-supplier strategy

Tesla will split production for its next-generation Dojo modules: Samsung will fabricate the chips on a 2 nm node while Intel provides module-level packaging and testing, using Embedded Multi-Die Interconnect Bridge to support large arrays for Artificial Intelligence training.