DeepSeek Unveils New AI Reasoning Technique

DeepSeek introduces a breakthrough in Artificial Intelligence reasoning with its innovative reward modeling approach.

DeepSeek has announced a new technique in artificial intelligence reasoning, utilizing a method known as reward modeling. This approach aims to guide large language models (LLMs) towards aligning with human preferences more effectively.

The company´s latest models, known as DeepSeek-GRM, have successfully integrated this reward modeling, enhancing the models´ abilities to understand and replicate human-like decision-making processes. This development marked a significant step forward in AI research, promising more intuitive and human-aligned AI interactions.

Experts believe this advancement could set a new standard in AI development, offering potential applications in various fields that rely on human-AI collaboration. DeepSeek´s approach could pave the way for more adaptable and responsive AI systems, reshaping how artificial intelligence interfaces with human-driven processes.

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Intel Fab 52 outscales TSMC Arizona in advanced wafer production

Intel Fab 52 in Arizona is producing more than 40,000 wafers per month on its 18A node, outpacing TSMC’s current Arizona output on older process technologies. The facility highlights Intel’s focus on advanced manufacturing for its own products while TSMC keeps its leading nodes primarily in Taiwan.

Intel details packaging for 16 compute dies and 24 HBM5 modules

Intel Foundry has outlined an advanced packaging approach that combines Foveros 3D and EMIB-T interconnect to scale silicon beyond conventional reticle limits, targeting configurations with 16 compute dies and 24 HBM5 memory modules in one package. The design is built around upcoming 18A and 14A process nodes and aims to support current and future high bandwidth memory standards.

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