XConn Technologies has announced plans to conduct a live, end-to-end demonstration of PCIe Gen 6.2 and CXL 3.1 technology at the upcoming Future of Memory and Storage (FMS25) event, which will be held from August 5 to 7 at the Santa Clara Convention Center. Positioned as a leader in next-generation interconnect technology, XConn is targeting high-performance computing and Artificial Intelligence workloads with its latest innovations.
The demonstration is set to highlight the capabilities of XConn´s advanced switching solutions, focusing on how these can support ultra-high bandwidth and exceptionally low latency well-suited for modern computing systems. The demonstration will emphasize the seamless integration of new memory and accelerator architectures, addressing key demands from enterprises seeking high throughput and real-time system responsiveness.
Attendees at FMS25 will gain firsthand exposure to the transformative impact of Peripheral Component Interconnect Express (PCIe) Gen 6.2 and Compute Express Link (CXL) 3.1. These technologies are instrumental in enabling the next wave of composable infrastructure and disaggregated computing, offering scalable solutions for data centers and organizations embracing modular system designs and future-proof performance. XConn´s presence at booth #1245 signals a commitment to advancing the infrastructure that underpins data-intensive applications.
