TSMC Expands U.S. Operations with Two Additional Arizona Fabs

TSMC accelerates its U.S. expansion, announcing two more chip fabs in Arizona to meet surging demand for advanced semiconductor manufacturing, including those for next-generation Artificial Intelligence applications.

TSMC, the world’s largest contract chipmaker, is deepening its commitment to U.S. manufacturing by announcing plans to construct its third and fourth semiconductor fabrication plants in Arizona later this year. This rapid expansion follows the completion of TSMC´s second Arizona fab and the start of volume production at its first site in the fourth quarter of 2024. The timeline for the second facility has been moved up by about six months in response to growing customer demand. The first Arizona plant is designated for manufacturing advanced 4nm chips, while the second will focus on 3nm processors. The newly announced fabs are set to adopt TSMC’s most sophisticated N2 and A16 nodes, targeting cutting-edge applications including those for Artificial Intelligence and high-performance computing.

This aggressive build-out forms part of a broader, multi-billion dollar U.S. investment strategy, although TSMC has not disclosed the precise figures in recent announcements. In total, TSMC intends to operate five additional semiconductor plants and a research center across the United States. The expansion not only positions TSMC as a pivotal player in America’s drive toward semiconductor resilience and technological leadership, but also brings crucial advanced chipmaking capacity closer to key corporate and government clients.

TSMC’s global outlook remains robust beyond the United States. Chairman C.C. Wei has dismissed speculation about potential production setbacks at the company’s new Kumamoto facility in Japan, confirming that the first Japanese fab achieved mass production with excellent yields before year-end 2024. A second Japanese plant is set to break ground once local infrastructure is ready. TSMC’s presence in Europe is also scaling up, with strong regulatory and public-sector support for its Dresden, Germany project. Construction began in August 2024, marking the site as Europe’s first dedicated FinFET-capable foundry operation. These comprehensive investments bolster TSMC’s role as a linchpin in the evolving global semiconductor supply chain, serving diverse regional markets with state-of-the-art manufacturing technology.

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