SK hynix showcased advanced memory technologies for the era of Artificial Intelligence and high-performance computing at Supercomputing 2025, held in St. Louis, the U.S., from November 16-21. The conference, held annually since 1988, brings together industry, academia and research institutions, and this year the convergence of Artificial Intelligence and high-performance computing was a central topic. Under the theme ‘Memory, Powering Artificial Intelligence and Tomorrow,’ SK hynix presented a technological vision intended to accelerate data analysis in computing systems.
At its booth, SK hynix presented core products including HBM, DRAM and eSSD solutions and ran demonstrations of those products in Artificial Intelligence and HPC environments to highlight its competitiveness. At the front of the booth the company displayed its latest HBM products, including the 12-layer HBM4 which it developed as a world-first in September 2025. HBM4 features 2,048 input/output (I/O) channels, twice that of the previous generation, and is described as delivering a significant increase in bandwidth while also offering more than a 40% boost in power efficiency. SK hynix positioned HBM4 as a suitable solution for ultra-high-performance Artificial Intelligence computing systems.
The company also presented the 12-layer HBM3E, described in the release as the highest performing commercialized HBM currently available on the market, and showed it alongside NVIDIA’s next-generation GB300 Grace Blackwell GPU. Overall the exhibit emphasized SK hynix’s memory lineup set to lead the Artificial Intelligence and high-performance computing markets, the demonstrations aimed to show real-world performance in AI and HPC workloads, and the company laid out a vision for accelerating data analysis across computing systems.
