SK hynix showcased its full-stack Artificial Intelligence memory portfolio at the 2025 OCP Global Summit in San Jose, California, held October 13 to 16. The event was hosted by the Open Compute Project, the world’s largest open data center technology collaboration community, and ran under the theme “Leading the Future of Artificial Intelligence.” SK hynix exhibited under the slogan “MEMORY, Powering Artificial Intelligence and Tomorrow,” and the company said the display was intended to address emerging trends in data center and Artificial Intelligence infrastructure.
The company’s interactive booth was organized into four sections covering HBM, AiM, DRAM, and eSSDs and featured product-based character designs, three dimensional models of key technologies, and live demonstrations. The centerpiece was SK hynix’s 12-layer HBM4. According to the company, it became the first in the world to complete development of HBM4 and establish a mass production system in September 2025. The HBM4 product features 2,048 input/output channels, twice that of the previous generation, and is described as offering increased bandwidth and more than 40 percent greater power efficiency.
SK hynix framed these technologies as optimizations for ultra-high-performance Artificial Intelligence computing systems and broader data center applications. By exhibiting a grouped portfolio that spans high-bandwidth memory, application integrated memory, conventional DRAM, and enterprise SSDs, the company emphasized improvements in both performance and energy efficiency for Artificial Intelligence workloads and data center infrastructure. The demonstrations and technical displays at the summit were presented as part of the company’s effort to advance industry solutions for next generation computing environments.
