A Lenovo product manager on Chinese social media showcased a Samsung LPCAMM2 module that is positioned as one of the highest capacity and highest speed implementations of this emerging memory form factor. The LPCAMM2 design is based on the SOCAMM2 interface and uses LPDDR5 or LPDDR5X DRAM, combining the performance and power efficiency benefits of low power mobile memory with a modular, serviceable format. Unlike conventional LPDDR solutions in notebooks, which typically rely on DRAM chips soldered directly to the mainboard, this approach allows the memory module to be replaced or upgraded.
The pictured Samsung module delivers 96 GB of density with a speed of LPDDR5X-9600, pairing unusually high capacity with a very fast data rate for mobile oriented memory. The LPDDR5X-9600 speed is described as being natively supported by upcoming Core Ultra Series 3 ‘Panther Lake’ mobile processors, specifically referencing compatibility with at least the Core Ultra X7 and X9 brand extensions. This alignment suggests that notebook designs built around these processors could leverage the new LPCAMM2 module to achieve both higher bandwidth and larger memory footprints without sacrificing the advantages of low power DRAM.
The emergence of such high density LPCAMM2 modules highlights a broader industry shift toward raising memory capacities in mainstream personal computers, particularly in thin and light notebooks where soldered LPDDR has been dominant. The report notes that, if not for the acute DRAM supply crisis, the mid-2020s were expected to see a more pronounced rise in PC mainstream memory densities, implying that supply constraints have tempered how quickly configurations like 96 GB can reach mass adoption. Even so, the Samsung LPCAMM2 module serves as an early example of where mobile and portable system memory design is heading as component availability improves.
