OKI Circuit Technology, a member of the OKI Group, has announced the successful development of 124-layer printed circuit board (PCB) technology aimed at wafer inspection equipment for next-generation high bandwidth memory (HBM) used in Artificial Intelligence semiconductors. This latest innovation marks a significant advancement, representing approximately a 15% increase in layer count compared to previous 108-layer designs, enabling enhanced performance in complex semiconductor testing environments.
The demand for more powerful Artificial Intelligence processing hardware is driving the need for faster, higher-capacity interconnects between graphics processing units (GPUs) and memory. As semiconductor chips continue to push the boundaries of processing speed and density, memory technologies such as HBM feature stacked DRAM structures that require wafer fabrication with ever-greater levels of thinness and precision. These requirements extend to the PCBs used in inspection equipment, where improved multilayer technology enables better signal integrity, higher speeds, and increased reliability.
OKI Circuit Technology is targeting mass production of its 124-layer PCB at its Joetsu Plant in Niigata Prefecture by October 2025. The facility has an established reputation for producing high multilayer, high-precision, large-format PCBs for semiconductor inspection equipment. The leap to 124 layers demonstrates OKI´s commitment to advancing the manufacturing technology needed to meet the stringent quality and performance demands of next-generation semiconductor and Artificial Intelligence industries.
