Nvidia and AMD are reportedly evaluating Intel Foundry’s 14A node as part of a broader reassessment of where leading chip designers source advanced process technology and assembly. According to GF Securities Hong Kong, this interest in Intel reflects a growing willingness among top design houses to diversify both front-end manufacturing and back-end packaging, rather than relying solely on incumbents such as TSMC. Capacity limits at alternative suppliers like TSMC are described as an important driver, with packaging availability now becoming a central constraint on roadmap execution for large customers.
On the Apple side, supply chain reports indicate the company has engaged Intel for process evaluation and is actively weighing different packaging routes for future products. Apple has reportedly worked with version 0.9.1 of the 18A-P process design kit and is awaiting PDK 1.0 or 1.1, expected in the first quarter of 2026, before moving into larger scale tests. This phased engagement suggests Apple is still in an exploratory stage, using early design kits to validate Intel’s process technology before committing more substantial volumes or flagship designs.
The Broadcom-assisted ‘Baltra’ server accelerator, which targets Artificial Intelligence workloads, was originally tied to TSMC’s N3 3 nm processes, but limited CoWoS capacity at TSMC has prompted Apple to consider Intel for packaging with EMIB options. At the same time, shipments of the custom Artificial Intelligence server parts now seem more likely in 2028, reflecting both packaging constraints and the need to qualify new manufacturing partners. The reporting also suggests that lower-end M-series chips built on Intel process technology could appear in 2027 if PDK revisions and yield targets prove sufficient for Apple, pointing to a potential split strategy where Apple uses Intel for some products while continuing to source others elsewhere.
