Flex and LG Electronics have announced a partnership to develop integrated, modular cooling solutions aimed at the escalating thermal management challenges of Artificial Intelligence era data centers. The collaboration is positioned to address the higher heat density in modern facilities by combining Flex’s data center infrastructure capabilities with LG’s thermal management technologies. The companies say the combined offering is intended for prefabricated deployments that can scale to meet growing demand.
The partnership merges Flex’s liquid cooling portfolio, proprietary power products, and IT infrastructure solutions with LG’s high-performance air and liquid cooling modules. Specific components named in the announcement include computer room air conditioners CRAC, computer room air handlers CRAH, chillers, and coolant distribution units CDUs, along with a full suite of thermal management and monitoring solutions. Together these elements are presented as a toolkit that data center operators can configure to match varying site requirements and rack densities.
Flex highlighted the business rationale for the tie up through a comment by Michael Hartung, president and chief commercial officer at Flex, saying the collaboration lets Flex offer a complete range of cooling solutions to address escalating heat challenges. The companies emphasize prefabrication and scalability as core benefits, aiming to increase energy efficiency, simplify deployment, and speed time to revenue for customers. The announcement frames the partnership as a response to the evolving needs of high-density data centers and as a way to give operators greater agility to customize solutions and scale infrastructure with demand.
