Intel Foundry convened customers and partners at its Direct Connect event, where company leaders outlined advancements across multiple process generations and cutting-edge packaging technologies. The gathering emphasized Intel Foundry´s commitment to evolving its manufacturing capabilities and supply chain, making a case for its diversified, global infrastructure as a foundation for innovation across industries.
CEO Lip-Bu Tan opened the event by discussing the next phase of Intel Foundry´s strategy, setting the tone for a series of keynotes. Naga Chandrasekaran, chief technology and operations officer, and Kevin O´Buckley, general manager of Foundry Services, highlighted the progress being made in core process technologies and advanced packaging methods. They focused on scalability, reliability, and how these advancements reinforce Intel Foundry´s value proposition for prospective customers and design partners.
Throughout the event, Intel announced new ecosystem programs and partnerships aimed at deepening collaboration within a systems foundry model. The company´s leaders underscored the importance of end-to-end solutions that integrate not only manufacturing but also co-design and service models, enabling customers to innovate faster in areas like Artificial Intelligence, data centers, and high-performance computing. The event positioned Intel Foundry as a platform that invites industry input and joint development to expand the potential of advanced silicon and systems solutions.
