Ansys has announced that its thermal and multiphysics signoff solutions have achieved certification for designs manufactured using the Intel 18A process technology. These tools are geared toward ensuring the functionality and reliability of advanced semiconductor systems required for high-demand applications such as Artificial Intelligence chips, graphic processing units, and high-performance computing products. The collaboration with Intel Foundry enables comprehensive multiphysics signoff analysis for designs leveraging Intel´s Embedded Multi-Die Interconnect Bridge (EMIB) technology, which facilitates the construction of complex, multi-die 3D integrated circuit systems.
The certified tools—Ansys RedHawk-SC and Totem—are recognized in the industry for their speed, accuracy, and large-scale capacity in analyzing power integrity and the reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors, which feature PowerVia backside power delivery. This analysis is critical to prevent issues related to power distribution, heat, and electromigration in leading-edge semiconductor devices manufactured with the Intel 18A process node.
Additionally, Ansys introduced HFSS-IC Pro, the latest offering in its HFSS-IC product family, which also received certification for the Intel 18A process. HFSS-IC Pro specializes in scalable electromagnetic analysis and is tailored for use in advanced on-chip radio frequency components, Wi-Fi, 5G/6G, and telecommunication technologies. This suite of certified solutions emphasizes Ansys´s commitment to supporting next-generation semiconductor manufacturing, providing the design community with the tools needed for robust, high-performance, and reliable chip design in emerging application domains.
