AMD and Celestica announced a strategic collaboration to bring the new Helios rack-scale Artificial Intelligence platform to market. The partnership combines AMD’s computing portfolio with Celestica’s expertise in data center infrastructure and networking switch technologies.
At launch, Celestica will undertake the R&D, design and manufacturing of scale-up networking switches in the AMD Helios rack-scale Artificial Intelligence architecture, based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor. The companies position the effort around an open standards-based design for rack-scale deployment.
The scale-up switches will utilize advanced networking silicon to enable the high-speed interconnect of the next-generation AMD Instinct MI450 Series GPUs, enabling leading-edge computing, optimized for large-scale Artificial Intelligence clusters. The networking switches will utilize the Ultra Accelerator Link over Ethernet (UALoE) architecture for scale-up connectivity. AMD Helios will be available to customers in late 2026.
