Recent leaks from hardware sleuths Olrak29 and InstLatX64 suggest that AMD´s AM5 socket will play host to a range of upcoming processors across desktop, mobile, and workstation segments. Their findings, interpreted by outlets such as VideoCardz, indicate that AMD´s Zen 5-based Ryzen Threadripper ´Shimada Peak´ 9000WX series is on track for a formal debut at Computex 2025, affirming prior reports of the workstation platform´s evolution. The Ryzen 9000G ´Gorgon Point´ APUs, integrating Zen 5 CPU cores and RDNA 3.5 graphics, have surfaced again with strong ties to the AM5 desktop socket, confirming long-standing speculation about AMD´s continued support for this platform.
The leaks also reveal the potential arrival of EPYC 4005 ´Grado´ chips, which appear to build on the Granite Ridge foundation (previously seen in Ryzen 7000 ´Raphael´), but repositioned to target entry-level commercial and enterprise markets. These chips are anticipated as successors to AMD´s current EPYC 4004 series and could offer affordable solutions for SMB and webhosting servers, marking a strategic expansion of server-class CPUs into the AM5 ecosystem.
On the mobile front, several Ryzen Artificial Intelligence Mobile SoCs linked to the FP8 socket have been identified, including a possible refresh named ´Krackan2.´ This model is hypothesized to feature a more cost-effective configuration, potentially with fewer cores and no integrated neural processing units, maintaining AMD´s focus on diversified Artificial Intelligence-enabled compute. Additionally, discussions about multiple ´Gorgon Point´ variants suggest one (´Gorgon Point3´) may be a reworked ´Krackan2´ design, hinting at product tiering and refresh cycles within AMD´s roadmap. Notably, references to FF5-based ´Soundwave´ and FP10-based ´Medusa Point´ APUs signal future platforms incorporating Arm architecture and Zen 6 + RDNA 3.5 combinations, respectively, further expanding AMD´s artificial intelligence and processor design ambitions for both traditional and next-generation mobile device footprints.
