AMD Acquires Enosemi to Advance Co-Packaged Optics for Artificial Intelligence Systems

AMD acquires Enosemi, expanding its expertise in photonics to fuel the next generation of Artificial Intelligence system interconnects.

AMD has officially acquired Enosemi, solidifying a strategic move aimed at accelerating innovation in co-packaged optics and photonics for next-generation Artificial Intelligence systems. Building on an established collaboration where Enosemi contributed as an external development partner, the acquisition brings Enosemi´s expertise and proven technology directly into AMD´s ecosystem. This move is expected to significantly enhance AMD´s capabilities to deliver high-performance photonics and interconnect solutions tailored to the growing demands of Artificial Intelligence workloads.

The Enosemi team, renowned for its elite experts and PhD-level talent, is headquartered in Silicon Valley and has demonstrated its ability to design, manufacture, and ship photonic integrated circuits at scale. This capability is described as a rare achievement in the industry, with only a select number of teams able to match such experience in photonic integration and volume production. Enosemi’s specialists are known for their technical rigor, deep engineering expertise, and a track record of reliable execution within the advanced photonics and semiconductor sectors.

By integrating Enosemi into its structure, AMD is positioning itself to more aggressively pursue high-performance interconnect solutions, a critical component for data-intensive Artificial Intelligence applications. The focus on co-packaged optics signals AMD´s intent to address bandwidth, latency, and energy challenges faced by future Artificial Intelligence hardware. This acquisition aligns with AMD´s rapidly evolving Artificial Intelligence strategy and strengthens its capacity to meet industry demands for faster, more efficient communication between processing components in both existing and emerging Artificial Intelligence systems.

73

Impact Score

Intel unveils massive artificial intelligence processor test vehicle showcasing advanced packaging

Intel Foundry has revealed an experimental artificial intelligence chip test vehicle that uses an 8 reticle-sized package with multiple logic and memory tiles to demonstrate its latest manufacturing and packaging capabilities. The design highlights how Intel intends to build next-generation multi-chiplet artificial intelligence and high performance computing processors with advanced interconnects and power delivery.

Reward models inherit value biases from large language model foundations

New research shows that reward models used to align large language models inherit systematic value biases from their pre-trained foundations, with Llama and Gemma models diverging along agency and communion dimensions. The work raises fresh safety questions about treating base model choice as a purely technical performance decision in Artificial Intelligence alignment pipelines.

Contact Us

Got questions? Use the form to contact us.

Contact Form

Clicking next sends a verification code to your email. After verifying, you can enter your message.