Intel debuts glass core substrate for multi chip accelerators
Intel has introduced a 10-2-10 glass core substrate with EMIB multi chip connectivity, targeting next generation high performance Artificial Intelligence and HPC accelerators with larger silicon area and finer signal routing.
Jensen Huang calls artificial intelligence boom the largest infrastructure buildout in history
Nvidia chief executive Jensen Huang told the World Economic Forum that artificial intelligence marks a new computing platform shift and the largest infrastructure buildout in human history, creating jobs from energy to software.
Samsung memory distributor claims 80% price hike as company issues denial
An anonymous Samsung memory distributor claims an immediate 80% price hike on a wide range of products, but Samsung has reportedly denied implementing a broad increase. The conflicting reports highlight uncertainty over how current memory shortages may translate into contract pricing in the coming quarter.
Intel Core Ultra X9 388H benchmarks point to strong multicore uplift
Early PassMark results for Intel’s Core Ultra X9 388H suggest substantial multicore gains over previous generation mobile chips and competitive performance against AMD’s latest Ryzen Artificial Intelligence 9 HX Pro 470, though variability between runs leaves some questions open.