NVIDIA to Manufacture AI Supercomputers in the US

NVIDIA plans to produce AI supercomputers in the US, bolstering supply chain resilience and economic growth.

NVIDIA is partnering with manufacturing leaders to establish facilities in the United States dedicated to producing NVIDIA AI supercomputers entirely within the country. These facilities, spanning over a million square feet, will focus on manufacturing NVIDIA Blackwell chips in Arizona and AI supercomputers in Texas.

The production of NVIDIA Blackwell chips is commencing at TSMC’s plants in Phoenix, Arizona, and supercomputing facilities are underway in Texas with partners Foxconn and Wistron. NVIDIA aims to commence full-scale production within 12-15 months, leveraging advanced manufacturing technologies and a robust supply chain.

In the next four years, NVIDIA plans to generate up to half a trillion dollars in AI infrastructure in the US by collaborating with industry giants like TSMC, Foxconn, and Amkor. This venture is set to enhance supply chain resilience and spur job creation, aligning with Jensen Huang´s vision of meeting increasing demands for AI technology while reinforcing America’s economic security.

The development taps into NVIDIA´s strengths, utilizing its AI, robotics, and digital twin technologies for efficient facility operation, including leveraging NVIDIA Omniverse and NVIDIA Isaac GR00T for advanced manufacturing automation.

77

Impact Score

IBM and AMD partner on quantum-centric supercomputing

IBM and AMD announced plans to develop quantum-centric supercomputing architectures that combine quantum computers with high-performance computing to create scalable, open-source platforms. The collaboration leverages IBM´s work on quantum computers and software and AMD´s expertise in high-performance computing and Artificial Intelligence accelerators.

Qualcomm launches Dragonwing Q-6690 with integrated RFID and Artificial Intelligence

Qualcomm announced the Dragonwing Q-6690, billed as the world’s first enterprise mobile processor with fully integrated UHF RFID and built-in 5G, Wi-Fi 7, Bluetooth 6.0, ultra-wideband and Artificial Intelligence capabilities. The platform is aimed at rugged handhelds, point-of-sale systems and smart kiosks and offers software-configurable feature packs that can be upgraded over the air.

Recent books from the MIT community

A roundup of new titles from the MIT community, including Empire of Artificial Intelligence, a critical look at Sam Altman’s OpenAI, and Data, Systems, and Society, a textbook on harnessing Artificial Intelligence for societal good.

Contact Us

Got questions? Use the form to contact us.

Contact Form

Clicking next sends a verification code to your email. After verifying, you can enter your message.