Teledyne e2v has started full production of its 16 GB DDR4-X1 Flight Model, expanding its portfolio of high-density, radiation-tolerant memory products for space applications. The component is aimed at spacecraft that need higher onboard processing and storage capacity while operating in demanding mission environments.
The new memory device is positioned for the growing requirements of Artificial Intelligence-enabled satellites, large constellations, broadband Internet-from-Space, Direct-to-Device services, and optical inter-satellite communications. By combining high memory density, radiation resilience, and a compact footprint, the component is intended to help spacecraft manage increasingly demanding onboard computing workloads.
Initial samples of the 16 GB DDR4-X1 Flight Models were delivered to customers in October 2025, allowing early system integration and evaluation. The device supports data rates up to 2400 MT/s, provides single-event latch-up immunity above 43 MeV·cm²/mg, and offers radiation tolerance up to 35 krad TID, enabling reliable operation in mission-critical space environments.
