SK hynix announced it has started supplying mobile dram products that adopt a high-k epoxy molding compound to provide highly efficient heat dissipation, marking an industry first. The company presented the development as a response to thermal challenges that emerge during heavy data transfer, and said the new material improves the ability of memory packages to move heat away from sensitive components.
The launch comes amid growing concern over heat generated by fast data transfers required for on-device Artificial Intelligence workloads. According to the announcement, that heat can degrade smartphone performance, particularly in high-performance flagship models. Global smartphone companies have welcomed the new dram, with expectations that the improved thermal characteristics will help address throttling and performance drops tied to elevated temperatures.
The statement also described how modern flagship designs use a package on package structure that stacks dram onto the application processor. That configuration allows more efficient use of limited internal space and improves data transfer speed, but it also traps heat generated by the application processor inside the stacked memory. SK hynix framed the adoption of the high-k epoxy molding compound as a targeted measure to reduce the thermal impact of that stacking and preserve device performance during intensive tasks.
