Siemens Digital Industries Software has extended its partnership with Intel Foundry, achieving significant milestones that include multiple product certifications, enhanced foundry reference flows, and technology enablement designed for next-generation integrated circuits and advanced packaging solutions. Siemens’ role as a founding partner of the Intel Foundry Accelerator Chiplet Alliance positions the company at the forefront of innovation for 3D integrated circuits and chiplet-based architectures, targeting a wide spectrum of semiconductor market sectors.
One of the major advancements from this collaboration is the certification of Siemens´ Calibre nmPlatform tool for the new Intel 18A production Process Design Kit (PDK). The Intel 18A process marks a substantial technological leap, introducing RibbonFET gate-all-around transistors for improved performance and the industry’s first PowerVia backside power delivery system. With this certification, mutual customers can continue using the Calibre nmPlatform as their standard sign-off verification solution while benefiting from Intel Foundry´s most advanced manufacturing capabilities. This enables chip designers to accelerate their development cycles and bring next-generation products to market more efficiently.
By ensuring compatibility with Intel’s cutting-edge process technology and fostering ecosystem collaboration through initiatives like the Chiplet Alliance, Siemens and Intel Foundry are addressing the growing complexity in semiconductor design. Their joint efforts support the evolution of advanced packaging for both two-dimensional and three-dimensional chips, paving the way for innovative system integration strategies across various applications and industries.
