Samsung is reportedly making a significant shift in its foldable smartphone strategy by equipping the upcoming Galaxy Z Flip 7 with its own Exynos 2500 mobile processor, according to a recent Chosun Daily report. If confirmed, this will be the first time Samsung´s in-house mobile application processor appears in a foldable device, replacing the Qualcomm Snapdragon chips previously used in the Galaxy Flip Z range up until 2025. The decision underscores Samsung´s push to feature proprietary silicon in its flagship models across multiple tiers, including the rumored Galaxy Z Fold 7 and potential ´FE´ Enterprise Edition models.
Industry sources and semiconductor analysts highlight that the Exynos 2500 will be manufactured using Samsung Foundry´s 3 nm gate-all-around (GAA) process, known as SF3. This production move has raised eyebrows due to reported yield issues, with some estimates putting the success rate of fully functional chips at only 40%. Despite this challenge, Samsung is said to be proceeding in order to cut costs and generate operational momentum for its foundry business, which has struggled against competitors. Some insiders suggest that, due to low production yields, the Exynos 2500 variant heading for the Galaxy Z Flip 7 may be underclocked—possibly earning the designation E2500E.
This chipset selection is widely seen as an interim step, as Samsung reportedly advances toward a more powerful 2 nm Exynos 2600 for its 2026 Galaxy S26 series. The use of the Exynos 2500 in the Z Flip 7 may serve an additional purpose by helping Samsung´s foundry workforce build expertise in high-volume 3 nm chip manufacturing, intended to translate into improved yields and efficiency for future, more advanced nodes like 2 nm (SF2). Samsung is expected to officially unveil the Galaxy Z Flip 7 lineup at its upcoming ´Unpacked´ event in July, with industry watchers closely following how this transition affects both device performance and the broader competitive dynamics in smartphone silicon.
