Hanmi Semiconductor is preparing to unveil new memory manufacturing equipment at Semicon Korea 2026, where the company is presenting a wide TC bonder positioned as an “alternative to Hybrid Bonder (HB) for High Bandwidth Memory (HBM) mass manufacturing.” The trade event began on February 11, and early booth imagery shows promotional material highlighting the latest production hardware. Local industry observers say that the commercialization of hybrid bonders has been delayed numerous times due to technical difficulties, which has created an opportunity for alternative bonding approaches in the high bandwidth memory market.
The wide TC bonder equipment, which is due for launch within the latter half of 2026, is described as a next-generation standard for HBM assembly. According to comments provided to Chosun Biz, the new platform “applies advanced precision (and fluxless) bonding technology that can improve HBM production yield, quality and completeness.” These improvements are expected to benefit incoming product lines such as HBM4, and Hanmi expects the wide TC bonder to play a crucial role in manufacturing future HBM5 and HBM6 products. The emphasis on fluxless, high precision bonding is aimed at addressing the stringent reliability and density requirements of advanced stacked memory used alongside Artificial Intelligence accelerators.
The introduction of the wide TC bonder aligns with longer term HBM technology roadmaps discussed by Korean research and industry partners. A joint presentation in the previous summer outlined an HBM development path extending into 2038, with KAIST and TERA describing a sequence that will start with HBM4 debut on NVIDIA “Rubin”-based Artificial Intelligence accelerators in 2026. By the end of the 2030s, they predict the arrival of HBM7, indicating sustained demand for advanced bonding solutions over multiple product generations as memory capacity and bandwidth targets continue to rise.
