Avicena, a company based in Sunnyvale, California, announced a collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to optimize photodetector (PD) arrays that are integral to Avicena´s LightBundle microLED-based interconnect technology. LightBundle is designed to deliver over 1 terabit per second per millimeter shoreline density and enable ultra-high-density die-to-die (D2D) connections that can extend up to ten meters with best-in-class energy efficiency of sub-picojoule per bit.
This innovation dramatically surpasses the capabilities of legacy copper-based interconnects, both in reach and in reduced power consumption. The advanced photodetector arrays powered by TSMC´s process technology will allow data to move quickly and efficiently between multiple racks populated with high-performance GPUs, which are increasingly critical for large-scale Artificial Intelligence workloads.
The rapid progress of Artificial Intelligence models is fueling unprecedented demands on compute and memory infrastructure. Modern systems now require interconnects that offer greater bandwidth density, lower power consumption, and a longer reach to support both processor-to-processor (P2P) and processor-to-memory (P2M) communications. By leveraging TSMC’s manufacturing expertise, Avicena aims to scale up networks to handle growing clusters of GPUs, effectively addressing the connectivity bottlenecks that limit current Artificial Intelligence data center architectures.
