AMD is reviving manufacturing ties with GlobalFoundries for Co-Packaged Optics in the next-generation Instinct MI500 series of Artificial Intelligence accelerators. The partnership marks a return to working with its former silicon manufacturing venture, which AMD sold back in 2008. AMD is pursuing the effort to strengthen its position in the Artificial Intelligence data center market, where traditional copper-based wiring limits signal transfer.
Co-Packaged Optics is intended to improve data movement by using light-based connections instead of copper, reducing speed loss and latency across links between multiple nodes and even multiple facilities. AMD is working to secure Photonics Integrated Circuit manufacturing through GlobalFoundries, while ASE will manage the packaging needed to complete the Co-Packaged Optics design. That division of responsibilities is designed to combine photonics manufacturing with advanced packaging for the final system.
The Instinct MI500 series of Artificial Intelligence accelerators is scheduled for release in 2027, while the current focus remains on the Instinct MI400 series, which includes multiple SKUs for Artificial Intelligence and HPC workloads. AMD expects the 2027 product generation to use Co-Packaged Optics to push performance further, with lower power use and much higher overall bandwidth than conventional copper data transfers. The effort also reflects a broader industry shift, as NVIDIA is also working with semiconductor manufacturers on a Co-Packaged Optics system for ‘Vera Rubin,’ especially the ‘Rubin Ultra’ variant.
