Hanmi wide TC bonder targets future HBM5 and HBM6 production

Hanmi Semiconductor is previewing a new wide TC bonder at Semicon Korea 2026, positioning it as an alternative to hybrid bonders for high bandwidth memory mass manufacturing. The tool is designed to boost yield and quality for upcoming HBM generations including HBM4, HBM5, and HBM6.

Best artificial intelligence video tools for fast content creation in 2026

A new wave of artificial intelligence video tools is turning scripts, articles, and raw clips into polished videos in minutes, with options ranging from text-to-video generators to smart collaborative editors. Different platforms target use cases such as social clips, animated explainers, and repurposed written content.