Huawei unveils atlas 950 and taishan 950 superpods at mwc 2026

Huawei introduced its latest atlas 950 superpod, taishan 950 superpod and new computing solutions at mwc barcelona 2026, positioning them as a resilient foundation for emerging artificial intelligence workloads. The company framed the launch as part of a broader push for open source, open collaboration and globally accessible computing options.

NanoIC releases advanced interconnect PDKs for chip to chip packaging

NanoIC has introduced two early access interconnect PDKs aimed at enabling high density, energy efficient chip to chip connectivity for research and industry innovators. The launch targets emerging demands in heterogeneous system architectures and advanced packaging for high performance computing and Artificial Intelligence accelerators.

Using artificial intelligence to manage net 30 credit terms for business growth

Businesses are increasingly turning to artificial intelligence to manage net 30 credit terms, using data driven tools to assess risk, protect cash flow, and personalize payment arrangements. By 2026, these technologies are expected to be embedded across credit management, reshaping how companies extend and monitor trade credit.