Rapidus develops glass panel-level packaging for high-performance artificial intelligence chips

Japanese foundry Rapidus has built a glass-based panel-level packaging prototype aimed at high-performance artificial intelligence hardware and plans to push it toward mass production by 2028, positioning itself as a potential rival to TSMC.

China reportedly tests domestically built euv lithography prototype

China has reportedly built and begun testing a domestically developed euv lithography prototype assembled from second-hand components and reverse-engineered designs. Huawei is leading a broader effort to create a fully domestic artificial intelligence semiconductor supply chain spanning chip design to advanced manufacturing tools.