SK hynix starts supplying mobile dram with efficient heat dissipation for Artificial Intelligence
SK hynix has begun shipping mobile dram that uses a high-k epoxy molding compound to improve heat dissipation, an industry first. The change targets thermal issues tied to fast data transfer for on-device Artificial Intelligence and is expected to help flagship smartphones.
China to triple domestic Artificial Intelligence accelerator output with Huawei and SMIC
China plans to triple domestic Artificial Intelligence accelerator production by dedicating a fabrication plant to Huawei´s Ascend chips and bringing two more plants online, sources say. SMIC will assist as Huawei builds an end-to-end domestic silicon supply chain.
TSMC accelerates 1.4 nm plans, targets 2027 pilot runs
TSMC has accelerated construction on fab 25 in the Central Taiwan Science Park to produce 1.4 nm wafers, aiming for risk production by the end of 2027 and high-volume ramp in the second half of 2028.
Giga Computing launches B-series 3U 10-node blade servers with recycled materials
Giga Computing unveiled its first 3U 10-node B-series blade servers, supporting AMD and Intel processor families and incorporating post-consumer recycled low-carbon materials to address enterprise sustainability goals.
Game on: Modders reimagine classics with NVIDIA RTX Remix and generative Artificial Intelligence
At Gamescom NVIDIA announced winners of the RTX Remix mod contest, showcasing how generative Artificial Intelligence and RTX Remix let small teams remake classic games with modern lighting and materials. Winning and standout projects demonstrate AI-driven texture generation, pipeline automation and GPU-accelerated workflows.