Global Semiconductor Materials Market Grows 3.8% in 2024

The global semiconductor materials market posted a 3.8% revenue increase in 2024, fueled by demand for advanced computing and memory technologies.

The global semiconductor materials market recorded a 3.8% revenue increase in 2024, according to the SEMI Materials Market Data Subscription (MMDS). This latest figure highlights the recovery of the broader semiconductor industry and the escalating need for advanced materials supporting high-performance computing and high-bandwidth memory manufacturing. SEMI, representing essential segments of the electronics design and manufacturing supply chain, noted that these factors contributed significantly to the overall uptick in materials revenue for the year.

Wafer fabrication materials saw their revenue climb by 3.3% to an unspecified total, while packaging materials experienced even stronger growth, rising 4.7% in 2024. The report specifically called out segments such as chemical mechanical planarization (CMP), photoresist, and photoresist ancillaries for robust double-digit growth. This surge was attributed to the greater processing complexity now required for cutting-edge DRAM, 3D NAND flash, and advanced logic integrated circuits. With the push for miniaturization and performance, every segment of the semiconductor materials market except for silicon and silicon-on-insulator (SOI) reported year-over-year revenue gains.

Despite the overall market expansion, the demand for silicon remained subdued, particularly in the trailing-edge technologies segment. The sector continued to experience soft demand due to the ongoing process of clearing excess inventory, resulting in a 7.1% decline in silicon revenue. The data underscores both the cyclical nature of semiconductor demand and the rising importance of advanced materials in next-generation electronics manufacturing.

62

Impact Score

IBM and AMD partner on quantum-centric supercomputing

IBM and AMD announced plans to develop quantum-centric supercomputing architectures that combine quantum computers with high-performance computing to create scalable, open-source platforms. The collaboration leverages IBM´s work on quantum computers and software and AMD´s expertise in high-performance computing and Artificial Intelligence accelerators.

Qualcomm launches Dragonwing Q-6690 with integrated RFID and Artificial Intelligence

Qualcomm announced the Dragonwing Q-6690, billed as the world’s first enterprise mobile processor with fully integrated UHF RFID and built-in 5G, Wi-Fi 7, Bluetooth 6.0, ultra-wideband and Artificial Intelligence capabilities. The platform is aimed at rugged handhelds, point-of-sale systems and smart kiosks and offers software-configurable feature packs that can be upgraded over the air.

Recent books from the MIT community

A roundup of new titles from the MIT community, including Empire of Artificial Intelligence, a critical look at Sam Altman’s OpenAI, and Data, Systems, and Society, a textbook on harnessing Artificial Intelligence for societal good.

Contact Us

Got questions? Use the form to contact us.

Contact Form

Clicking next sends a verification code to your email. After verifying, you can enter your message.