Intel Unveils Next-Gen Core Ultra ´Panther Lake´ Processor at Computex 2025

Intel´s ´Panther Lake´ Core Ultra Series 3 brings a fresh chip design, advanced graphics, and enhanced efficiency, making waves for Artificial Intelligence and mobile performance at Computex 2025.

Intel showcased its upcoming Core Ultra Series 3 processor, codenamed ´Panther Lake,´ during Computex 2025, highlighting significant advancements in both architecture and performance. The mobile H-segment version features a slim, rectangular package, reminiscent of previous ´Arrow Lake-H´ and ´Meteor Lake´ chips, but introduces a novel tile arrangement. Dominated by two key tiles, the design includes a larger Graphics + SoC tile and a smaller Compute tile housing the CPU cores, with additional slender tiles allocated for I/O functions.

´Panther Lake´ debuts a new generation of integrated graphics technology, utilizing the advanced Xe3 ´Celestial´ architecture to boost visual and computational capabilities. The CPU configuration employs the latest ´Cougar Cove´ performance cores and ´Darkmont´ efficient cores, both delivering notable improvements in instructions-per-clock (IPC) compared to the ´Lion Cove´ and ´Skymont´ predecessors. Intel demonstrated not only the physical hardware but also operational samples of the chip on validation platforms at the event.

Engineered to match the efficiency metrics of ´Lunar Lake´ while surpassing the performance benchmarks set by ´Arrow Lake-H,´ ´Panther Lake´ is expected to leverage Intel´s new 18A foundry node for its Compute tile. Intel confirmed that ´Panther Lake´ remains on schedule for mass production in the latter half of 2025. The first consumer devices using these next-generation processors are anticipated to debut at CES 2026, signaling a major leap in power-efficient, high-performance computing for mobile platforms and workloads related to Artificial Intelligence.

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IBM and AMD partner on quantum-centric supercomputing

IBM and AMD announced plans to develop quantum-centric supercomputing architectures that combine quantum computers with high-performance computing to create scalable, open-source platforms. The collaboration leverages IBM´s work on quantum computers and software and AMD´s expertise in high-performance computing and Artificial Intelligence accelerators.

Qualcomm launches Dragonwing Q-6690 with integrated RFID and Artificial Intelligence

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