US Considers Expanding Export Blacklist to Include Chinese Chipmaker CXMT

The US government is reportedly weighing tighter export controls targeting China´s CXMT, as geopolitical tensions persist and the chipmaker´s technological rise attracts scrutiny.

The US Government´s Bureau of Industry and Security (BIS) is reportedly considering adding ChangXin Memory Technologies (CXMT) to its growing export blacklist, according to sources cited by the Financial Times. This move comes only two months after the US government expanded restrictions on exports to around eighty Chinese business entities. Despite a temporary easing of tariff actions, broader political and technological frictions between the United States and China remain pronounced.

Current US export restrictions already target major Chinese semiconductor players such as Semiconductor Manufacturing International Corp (SMIC) and Yangtze Memory Technologies Co. However, some of these entities are believed to have navigated around certain constraints by leveraging associated subsidiaries. The latest reports suggest that the US administration is probing these structures and weighing whether ostensibly independent players, like CXMT, should also fall under stricter export controls.

CXMT, established in 2016, has rapidly emerged as a notable force in China´s memory manufacturing sector, specializing in commercial DDR5 and DDR4 memory products. Although the company claims to operate independently from the Chinese military, its advancements—most notably in DDR5 technology—have drawn the attention of both international observers and US regulators. Insiders suggest that if blacklisted, CXMT would join a growing roster of Chinese technology firms facing significant hurdles in accessing critical foreign semiconductor technology and manufacturing tools. Industry sources previously reported in March 2024 that new sanctions targeting CXMT were under review, underscoring ongoing US attempts to maintain a technological edge while scrutinizing China´s progress in sectors such as advanced memory modules.

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