Intel Foundry´s push to expand its client base for the advanced 18A node has gained significant momentum, with recent reports from Chosun Biz revealing that Microsoft has finalized a major foundry agreement to utilize the 18A process. Negotiations with Google are reportedly progressing, indicating Intel´s active pursuit of securing another leading cloud provider for its flagship technology. The 18A node, which began risk production earlier this year, is scheduled to enter full-scale volume manufacturing by the end of 2025, highlighting Intel´s accelerated timeline to market readiness.
In addition to the baseline 18A technology, Intel is advancing its roadmap with two refined versions—18A-P, set for introduction in 2026, and 18A-PT, targeted for 2028. Prototype wafers for 18A-P have already emerged from Intel´s domestic fabrication plants, demonstrating the company’s rapid node progression. Intel is also preparing for future innovation by distributing early process design kits (PDKs) for its next-generation 14A node among select partners, laying groundwork for extended scaling well beyond the 18A era.
Intel´s strategic manufacturing investments are extensive, spanning significant operations across the United States and global sites. Two major fabrication plants are under construction in Arizona, representing a combined NULL billion commitment, complemented by expanded packaging capabilities in New Mexico and new logic plants in Oregon and Ohio. These developments may help shield Intel from international tariff uncertainties and bolster its competitiveness. Internationally, Fab 34 in Ireland is preparing for Intel 4 node and 3 nm chip mass production, while Israel’s Fab 38 is being equipped for high-performance, EUV-based wafer output. An advanced packaging facility in Penang, Malaysia, further enhances Intel’s global assembly and testing infrastructure, supporting the company’s ambitious expansion into new technology nodes and advanced chip manufacturing for top-tier cloud and technology clients.
